There has been a lot of speculations and leaks about the so called Xiaomi Mi 7. Now reports indicate that the phone will come with 3D sensing technology – the first Android phone to have the feature. As per reports, the phone could be launched in the third quarter of this year.
The Mi 7 was originally planned to be launched in the first half of this year itself. “However, such a plan is likely to be delayed to the third quarter of 2018 due to a low successful rate for facial recognition caused by slow adjustment processes of related software at Qualcomm,” as per Digitimes Research.
As per the report, Samsung and Huawei have also planned to bring a phone with 3D sensing technology. However, at this point of time the best 3D sensing module – jointly developed by Qualcomm, Himax Technologies and Truly Opto-electronics – can only be used with Qualcomm’s Snapdragon 845 CPU. Both Samsung and Huawei are not inclined to use this Chipset in their phones.
Samsung, the report says, may now bring a phone wit 3D sensing in 2019.
Recently a report claimed that the Mi 7 will come with an under-display fingerprint scanner too.
As per earlier reports, Mi 7 could come with a 5.6-inch display with 1440 x 2880 Pixel resolution, Snapdragon 845 SoC with Adreno 630 GPU, Android 8.0 Oreo running MIUI 9, 64GB/128GB of internal capacity, 6GB/8GB RAM, non-removable 4480mAh battery with quick charge, 16-megapixel dual rear camera with dual tone LED flash and 13-megapixel front camera.
(Disclaimer: The above picture is a concept render of Mi 7)