Qualcomm is expected to launch itsnext flagship chipset, the Snapdragon 845, in early December. The processor will be an upgrade of Snapdragon 835 and itwill be reportedly announced on the Qualcomm’s Snapdragon Technology Summit, which willbe held from December 4 to 8 in Hawaii, according to the leaked invite poster on the Weibo.
The new Snapdragon 845 is expected to be manufactured by Samsung on the 10 nm FinFET process same as the Snapdragon 835, though some rumours claimit to be based on 7nm FinFET technology. Further, it will feature four ARM Cortex-A75 cores and four ARM Cortex-A53 cores. On the graphical front, the Chipset will come with the Qualcomm’s Adreno 630 GPU.
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Additionally, the next-gen chipset will come with the Snapdragon X20 modem, which will offer up to 1.2 Gbps of download speed making it the highest downloading speed by the Qualcomm processors. AsHuawei and Apple have built-in AI units in their HiSilicon Kirin 970 and A11 bionic, the Qualcomm is expected to do the same with its Snapdragon 845.