Qualcomm has introduced its new mid-range chipset, the Snapdragon 670 Mobile Platform. The latest system-on-chip (SoC) is expected to available in smartphones in the third quarter of 2018.
The latest Chipset from Qualcomm comes loaded with 3rd generation AI Engine, which the brand claims delivers 1.8x AI performance improvements as compared to the previous generation. The on-device AI capabilities will help improve real-time responsiveness, enhanced reliability and more even when the device the lacks network connection. It also features smart camera settings and it uses the same Qualcomm Hexagon 685 DSP, which is present in high-end mobile platforms.
On the camera front, it also equips Qualcomm Spectra 250 ISP, which supports up to a 25-megapixel single camera or up to 16-megapixel dual cameras. With the latest chipset, users could also record Ultra HD videos at 30fps.
Coming to the performance, Qualcomm Snapdragon 670 mobile platform is based on the 10nm process and it houses eight Kryo 360 CPU cores. Out of eight cores, two are performance cores clocked at 2.0GHz, while six are efficiency cores clocked at 1.7GHz. The company claims that the chipset delivers up to 15 per cent higher performance as compared to its predecessor.
The chipset also houses Snapdragon X12 Modem, which offers up to 600Mbps of download speeds and up to 150Mbps of upload speeds. The Modem automatically switches between LTE and WiFi, depending on which mode has better signal quality and speed. Further, OEM can also use both LTE and WiFi to boost download speeds. Apart from this, the chipset features Qualcomm Quick Charge 4+ fast charging, support for Full HD+ display, 2×2 802.11ac with Mu-MIMOWiFi, NFC, Bluetooth 5.0, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, Qualcomm aptX audio technology and more.