MediaTek has introduced its latest processor, the Dimensity 8300, as the powerhouse for Android smartphones. Built on TSMC’s advanced second-generation 4nm process technology, this chip boasts a 20 percent improvement in performance and a 30 percent reduction in power consumption compared to its predecessor.
The Dimensity 8300, an octa-core chip, features four Arm Cortex-A715 performance cores and four Cortex-A510 efficiency cores, clocked at 3.35GHz and 2.2GHz, respectively. Supporting LPDDR5x memory and UFS 4 storage with Multi-Circular Queue (MCQ) support, benchmark scores suggest it can rival Qualcomm’s Snapdragon 8 Gen 2 SoC.
The chip incorporates a Mali-G615 GPU, using 55 percent less power while delivering a 60 percent performance boost over the previous model, as per a statement issued by the company. It also features MediaTek’s HyperEngine game technology for ensuring optimal device temperature during gaming sessions.
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The Dimensity 8300 focuses on imaging capabilities, boasting an Imagiq 980 ISP for photos and videos, offering 4K60fps HDR with improved power consumption. It supports smartphone cameras with a maximum Resolution of 320 megapixels.
The chip is equipped with an APU 780 AI processor, providing a 2x and 3.3x increase in performance in INT/FP16 computation and AI performance, respectively. It supports on-device generative AI technology with up to 10 billion parameters and Stable Diffusion.
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On the connectivity front, the Dimensity 8300 features a 3GPP Release-16 Modem supporting 5G and 4G LTE. Wi-Fi 6E and Bluetooth 5.4 support, along with GPS, GLONASS, and NavIC support for satellite-based navigation, complete its comprehensive connectivity features.
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According to MediaTek, smartphones powered by the Dimensity 8300 are set to hit the market before the end of the year. Positioned to compete with Qualcomm’s Snapdragon 8 Gen 2 and Snapdragon 8+ Gen 1 chips, specific models featuring the Dimensity 8300 are yet to be announced, but smartphone makers are expected to unveil upcoming models in the coming weeks and months.