LG is all set to launch the much-awaited flagship device, the G6, next month at the Mobile World Congress 2017 which will be held in Barcelona. The company has started sending out the media invites for its press event which will take place on February 26 at 12:00 local time, where it is expected to launch the upcoming flagship device.
The invite shows an outline of a smartphone with text saying “See More, Play More.” The first part of the text hints that the smartphone will come with a larger screen. This is in line company’s recent teaser video
which hinted that the next flagship will sport a big screen in a smaller body frame. On the other hand, ‘Play More’ could simply mean a bigger battery backup or a high-end Processor could be installed in the upcoming smartphone.
Previously, a report highlights the company will use heat pipes in the G6 to disperse heat away from the processor. According to a report by Korean Herald, LG will start to use heat pipes made of copper, which is mainly used in laptops and personal computers to stop the device from overheating. This feature will help reduce temperatures by 6 to 10 per cent by dispersing the internal heat, making it less porn Galaxy Note 7-like incidents.
Lg is also planning to run the upcoming device through harsher test than international standards. The company is said to be conducting battery heat exposure test to a temperature 15 percent higher than the required standard in the US and Europe. LG will also undergo diverse test such as piercing it with a sharp nail or dropping a heavy object on it from a high place, the report adds further.
As for the specs are concerned, the smartphone might sport a 5.7-inch QHD+ display with a Resolution of 2880×1440 pixels. The smartphone is rumoured to sport the latest Qualcomm Snapdragon 835 processor and would sport 3.5mm Headphone jack and might use USB Type-C for charging and data syncing. LG is also likely to keep the Hi-Fi Quad DAC for high-quality audio output via headsets.